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Home » Simple heating step boosts pressure sensitivity in semiconductor materials eightfold

Simple heating step boosts pressure sensitivity in semiconductor materials eightfold

Tech Xplore by Tech Xplore
7 months ago
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Stronger cell phone signals, more accurate sensors and cleaner energy may be achieved by adding a simple step to the industrial fabrication process of certain semiconductor materials, documented in a recent study led by engineering researchers at the University of Michigan.

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